Precision Surface Grinding of Silicon Carbide
Silicon carbide (SiC) is well known for its excellent material properties, high durability, high wear resistance, light weight and extreme hardness. Among the engineering applications of this material, it is an excellent candidate for optic mirrors used in an Airbone Laser (ABL) device. However, the low fracture toughness and extreme brittleness characteristics of SiC are predominant factors for its poor machinability. This paper presents surface grinding of SiC using diamond cup wheels to assess the performance of diamond grits with respect to the roughness produced on the machined surfaces and also the morphology of the ground work-piece. Resin bonded diamond cup wheels of grit sizes 46 Âµm, 76 Âµm and 107 Âµm; depth of cut of 10 Âµm, 20 Âµm and 30 Âµm; and feed rate of 2 mm/min, 12 mm/min and 22 mm/min were used during this machining investigation. It has been observed that the 76 grit performs better in terms of low surface roughness value and morphology.
 Gao, D; Wijesundara, M.B.J.; Carraro, C.; Low, C.W.; Howe, R.T. & Maboudian, R. (2003). High modulus polycrystalline 3C-SiC technology for RF MEMS, Proc. Transducers 12th Int. conf. Solid-State Sensors and Actuators, pp. 1160-1163
 Ashurst, W.R.; Wijesundara, M.B.J.; Carraro, C. & Maboudian, R. (2004). Tribological impact of SiC coating on released polysilicon structures, Tribol. Lett., Vol.17, No.2, pp. 195-198
 Konneh, M., Iqbal, M. and Faiz, N. M. A. (2012). Diamond Coated Endmills in Machining Silicon Carbide, Advanced Material Research, Vol.576, pp 531-534
 Venkatesh V C, Izman S, Sharif S, Mon T T, Konneh M. Ductile Streaks in Precision Grinding of Hard and brittle Materials. Sadhana. 2003; 28 (5): 915-924.
 Ravindra, D; Patten, J. & Tano, M. (2007). Ductile to brittle transition in a single crystal 4H SiC by performing nanometric machining, Proc. ISAAT 2007 Precision Grinding and Conference, Advances in Abrasive
 Bifano, T.G.; Dow, T.G. & Scattergood, R.O. (1991). Ductile regime grinding- a new technology for machining brittle materials, Journal of Engineering for Industry, Vol.113, pp. 184-189
 Alao A R. Precision Micro-scaled Partial Ductile Mode Machining of Silicon. MSc Thesis, International Islamic University, Malaysia. 2007.
How to Cite
© Copyright: The Author(s)
Creative Commons: CC BY 4.0
Copyright of articles that appear in International Journal of Engineering Materials and Manufacture (IJEMM) are belonged to “The Author(s)” under terms and conditions of Creative Commons Attribution 4.0 International Public License (CC BY 4.0). https://creativecommons.org/licenses/by/4.0/legalcode