Failure Analysis of Diode Components of Electronic Relay Packages Via Thorough Microstructural Characterization. International Journal of Engineering Materials and Manufacture, [S. l.], v. 4, n. 3, p. 124–136, 2019. DOI: 10.26776/ijemm.04.03.2019.05. Disponível em: https://deerhillpublishing.com/index.php/ijemm/article/view/90. Acesso em: 15 may. 2025.